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poly-MED

Polymers for active medical implants

The formation and prediction of strong autohesive bonds under glass transition temperature and at low pressure is a major breakthrough in polymer adhesion. The generation of strong autohesive bonds will resolve the fundamental bonding challenges that prevented polymers from being used in the medical, electronic and micro-fluidics applications. For active medical implants, this realization means that electronic components will be encapsulated hermetically by polymers without the  need to use damaging high temperatures and pressures or toxic adhesives. The use of polymers as encapsulates in active medical implants will increase the longevity and reduce the risk of tissue softening surrounding the implant and body rejection. Devising the methods to control polymers surface energy and establish its correlations with autohesion will unravel the contribution of the thermodynamic mechanism to adhesion phenomena, a topic that is still in debate internationally.

Date: 
Saturday, 1 September, 2012 to Monday, 31 August, 2015
Funding: 
Co-funded Marie Curie Grant